Hefei Zhonghangcheng Electronic Technology Co., Ltd. is a high-tech enterprise integrating research, development, production and operation. It is committed to providing high-reliability multi-chip module packaging structure solutions and customized integrated packaging shell products for global system-in-package customers. . The company was established in August 2017 with a total registered capital of 28.77 million yuan. It has two wholly-owned subsidiaries (Suzhou Zhonghangcheng Electronic Technology Co., Ltd. and Hefei Advanced Packaging Ceramics Co., Ltd.), a holding company (Hefei Chunjun Material Technology Co., Ltd. company).
Won the title of Youth Entrepreneurship Guiding Fund and Technology Leading Talent;
Won the certification of young eagle enterprise, gazelle enterprise, small technology giant enterprise, specialized new enterprise and new R&D institution;
Passed the GJB quality system certification, the third-level confidentiality qualification certificate for weapon equipment scientific research and production units, the high-tech enterprise, ISO9000, ROHS, REACH and other certifications;
Received multiple rounds of investment and financing such as Anhui Guoyuan Angel, Hefei Angel Investment, Hefei High-tech Keqi, and Hefei Emerging Industries.
The company has a new technology research and development center and a technical engineering department, which respectively conduct research and development on new materials, new process applications and SOP standardized packaging to ensure that new technology research and development and batch products are carried out simultaneously.
The core team comes from well-known research institutes at home and abroad, such as China Electric Power Technology, Peking University, Central South University, and California Institute of Technology.
At this stage, the micro-assembly and micro-package markets at home and abroad have shown a trend of rapid development, and new materials and new processes are constantly being introduced. New soft and hard brazing processes such as tin, gold germanium, tin silver copper and silver copper have been widely used.
The company's core technical team closely focuses on the application of the above advanced packaging materials to carry out technical research, and forward-lookingly proposes the concept of SOP system integrated packaging, taking the system as the design object, emphasizing the integration of circuit design and integrated manufacturing, and the compatibility of process materials with structure and circuit integration. SOP is compatible with SOC, MCM, SIP and other advanced packaging technologies. Through composite material application and efficient thermal management design, the specific requirements of high density, high power, miniaturization and low cost of chip packaging modules are realized, reflecting the integrated design and integration Manufacturing systems integration thinking.
Through years of technical accumulation and scientific and technological research, the company has correspondingly equipped with heat-adaptive mold design, structural reliability finite element analysis, microwave radio frequency simulation, brazing and sealing, surface coating, precision machining, HTCC high temperature ceramic technology, etc. Core design and process technology.